The book is talking about CMOS design rules. It has nothing to do with wire bonds. For any given CMOS fabrication process there is an extensive list of "design rules" that constrain all kinds of things.

In this case they are talking about the width of a metal line (which they are calling a "wire") and a rule that reduces the chance of that line coming off the surface that it should be attached to (liftoff). If the metal line is fairly short it can be narrow and will remain in place anchored by whatever is on either end. But if the metal line is long it must be wider to better stick to the surface.

The book is talking about CMOS design rules. It has nothing to do with wire bonds. For any given CMOS fabrication process there is an extensive list of "design rules" that constrain all kinds of things.

In this case they are talking about the width of a metal line (which they are calling a "wire") and a design rule that reduces the chance of that line coming off the surface that it should be attached to (liftoff). If the metal line is fairly short it can be narrow and will remain in place anchored by whatever is on either end. But if the metal line is long it must be wider to better stick to the surface.