USB 2.0 Specification

Universal Serial Bus Revision 2.0 specification (.zip file format, size 12.4 MB) provides the technical details to understand USB requirements and design USB compatible products. Modifications to the USB specification are made through Engineering Change Notices (ECNs). Enclosed in this zip file are the following documents:

1. The Original USB 2.0 specification released on April 27, 2000
2. USB 2.0 Adopters Agreement
3. Errata to the USB 2.0 specification as of December 7, 2000
4. Mini-B connector Engineering Change Notice to the USB 2.0 specification
5. Pull-up/pull-down Resistors Engineering Change Notice to the USB 2.0 specification
6. Errata to the USB 2.0 specification as of May 28, 2002
7. Interface Association Descriptor Engineering Change Notice to the USB 2.0 specification
8. Rounded Chamfer Engineering Change Notice to the USB 2.0 specification as of October 8, 2003
9. Unicode Engineering Change Notice to the USB 2.0 specification as of February 21, 2005
10. Inter-Chip USB Supplement Revision 1.0 as of March 13, 2006
11. Micro-USB Cables and Connectors Specification Revision 1.01 as of April 4, 2007
12. USB 2.0 Link Power Management Addendum Engineering Change Notice to the USB 2.0 specification as of July 16, 2007
13. High-Speed Inter-Chip USB Electrical Specification Revision 1.0 as of September 23, 2007
14. Suspend Current Limit Changes Engineering Change Notice to the USB 2.0 Specification as of April 9, 2008
15. 5V Short Circuit Withstand Requirement Change Engineering Change Notice to the USB 2.0 Specification as of December 22, 2008
16. Device Capacitance Engineering Change Notice to the USB 2.0 Specification as of December 22, 2008
17. Material Change Engineering Change Notice to the USB 2.0 Specification as of December 22, 2008
18. USB 2.0 Phase-locked SOFs Engineering Change Notice to the USB 2.0 Specification as of December 22, 2008
19. MicroUSB Micro-B ID Pin Resistance and Tolerance stack-up between D+ and D- Engineering Change Notice to the MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 as of December 22, 2008
20. USB 2.0 Connect Timing as of April 24, 2009
21. Quad Type Cable Additional for Micro USB ECN as of December 29, 2009
22. Clarification on the Chamfer on USB 2.0 Micro Connectors ECN as of March 23, 2010
23. Maximum Unmating Force Value Definition to USB 2.0 Micro Connectors ECN as of March 23, 2010
24. "On-The-Go Supplement to the USB 2.0 Specification" Adopters Agreement
25. USB On-The-Go and Embedded Host Testability ECN as of July 26, 2010
26. USB TEST_MODE Selector Values ECN as of July 26, 2010
27. Errata for "On-The-Go and Embedded Host Supplement to the USB Revision 2.0 Specification, Revision 2.0, June 4, 2010" as of July 14, 2011
28. Errata for USB 2.0 ECN:  Link Power Management (LPM) - 7/2007 as of October 11, 2011
29. On-The-Go and Embedded Host Supplement to the USB Revision 2.0 Specification, Revision 2.0 version 1.1 as of April 17, 2012
30. HSIC ECN as of May 21, 2012

Please check this site for any future updates to the USB 2.0 specification.

LEGAL DISCLAIMER

THIS SPECIFICATION IS PROVIDED "AS IS" AND WITHOUT ANY WARRANTY OF ANY KIND, EXPRESSED OR IMPLIED. WITHOUT LIMITATION, THERE IS NO WARRANTY OF NON-INFRINGEMENT, NO WARRANTY OF MERCHANTABILITY, AND NO WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE. ALL WARRANTIES ARE EXPRESSLY DISCLAIMED.

USER ASSUMES THE FULL RISK OF USING THIS SPECIFICATION. IN NO EVENT SHALL USB-IF BE LIABLE FOR ANY ACTUAL, DIRECT, INDIRECT, PUNITIVE, OR CONSEQUENTIAL DAMAGES ARISING FROM SUCH USE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Wireless USB Specification

The Wireless USB Specification Revision 1.1 is available here.

USB 2.0 Adopters Agreement
USB 2.0 Adopters Agreement (.pdf file format, size 28k)
The USB 2.0 Adopters Agreement allows a signing company to participate in a reciprocal, royalty-free licensing arrangement for compliant products. Any USB 2.0 Adopters Agreement shall only be effective if received within one (1) year after first sale of products that include 'Compliant Products'. See the USB 2.0 Adopters Agreement for details.

USB 2.0 On-The-Go Specification Supplement Adopters Agreement
The USB 2.0 Promoters have voted to adopt an addendum to the USB 2.0 Specification designated "On-The-Go Supplement to the USB 2.0 Specification" (the "Specification Supplement"). A copy of the Specification Supplement is located at: www.usb.org/developers/onthego). This letter is to provide USB 2.0 Adopters the option of extending their Adopter Agreement to address this new Spec Supplement (the Spec Supplement exceeds the scope of your original USB 2.0 Adopters Agreement, which is specific to the USB 2.0 Specification).

Adopters are under no obligation to amend their Adopters Agreement. However, those Parties that are Adopters as of the date of this Amendment Letter wishing to amend their Adopters Agreement must have the Amendment Letter (.pdf file format, size 16k) executed by a duly authorized representative and return the original signed letter to the address below to expand the scope of their Adopters Agreement. Once you have signed the Amendment Letter, return the original to the USB 2.0 Promoter Group at:

USB 2.0 Promoter Group
3855 SW 153rd Drive
Beaverton, OR 97006
USA

Low Voltage Inter-Chip Adopters Agreement Amendment

The USB 2.0 Promoters have voted to adopt an addendum to the USB 2.0 Specification designated "Low Voltage Inter-Chip Supplement to the USB 2.0 Specification" ("Spec Supplement", posted with the USB 2.0 spec above) and to provide USB 2.0 Adopters the option of extending their Adopter Agreement to address this new Spec Supplement (the Spec Supplement exceeds the scope of your original USB 2.0 Adopters Agreement, which is specific to the USB 2.0 Specification).

Adopters are under no obligation to amend their Adopters Agreement. However, those Parties that are Adopters as of the date of this Amendment Letter wishing to amend their Adopters Agreement must have the Amendment Letter (.pdf file format, size 12k) executed by a duly authorized representative and return the original signed letter to the address below by no later than March 20, 2007 to expand the scope of their Adopters Agreement. Parties becoming Adopters after the date of this Amendment Letter may amend their Adopters Agreement by signing and returning this Amendment Letter to the address below within their Adoption Period. Responses from existing USB 2.0 Adopters post marked after the applicable deadline are considered null and void. Once you have signed the Amendment Letter, return the original to the USB 2.0 Promoter Group at:

USB 2.0 Promoter Group
3855 SW 153rd Drive
Beaverton, OR 97006
USA

High-Speed Inter-Chip Adopters Agreement Amendment

The USB 2.0 Promoters have voted to adopt an addendum to the USB 2.0 Specification designated "High-Speed Inter-Chip Supplement to the USB 2.0 Specification" ("Spec Supplement", posted with the USB 2.0 spec above) and to provide USB 2.0 Adopters the option of extending their Adopter Agreement to address this new Spec Supplement (the Spec Supplement exceeds the scope of your original USB 2.0 Adopters Agreement, which is specific to the USB 2.0 Specification).

Adopters are under no obligation to amend their Adopters Agreement. However, those Parties that are Adopters as of the date of this Amendment Letter wishing to amend their Adopters Agreement must have the Amendment Letter (.pdf file format, size 16k) executed by a duly authorized representative and return the original signed letter to the address below by no later than September 24, 2008 to expand the scope of their Adopters Agreement. Parties becoming Adopters after the date of this Amendment Letter may amend their Adopters Agreement by signing and returning this Amendment Letter to the address below within their Adoption Period. Responses from existing USB 2.0 Adopters post marked after the applicable deadline are considered null and void. Once you have signed the Amendment Letter, return the original to the USB 2.0 Promoter Group at:

USB 2.0 Promoter Group
3855 SW 153rd Drive
Beaverton, OR 97006
USA

USB Device Class Specifications. Building on top of the USB specifications, there are Device Class Specifications from the Device Working Group. These specifications recommend design targets for classes of devices. For HID related information, please go to the HID Web page.

Intellectual Property Rights Notices
This page contains links to a reproduction of letters received by the USB-IF from patent owners asserting intellectual property rights that may be pertinent to the implementation of a USB specification. For specific information regarding the licensing of intellectual property rights arising from a particular USB Specification, the reader should consult the appropriate USB Adopters Agreement for that specification.

Notice to all readers: The USB-IF is providing this information as a courtesy to our members 'AS IS' and without warranty of any kind. The USB-IF is not responsible for content of the individual postings. The USB-IF will not be responsible for identifying patents for which a license may be required by a USB Specification nor for conducting inquiries into the legal validity or scope of those patents that are brought to its attention.

USB 2.0 Icon Design Guideline This design guideline provides a recommendation to PC OEMs on how to distinguish USB 2.0 ports to address the scenario where a high-speed device is plugged into a Original USB (full/low-speed) port.

USB Technical Documents

These are some resources useful to USB developers:

High Speed USB Platform Design Guidelines (.pdf file format, size 298k) This document provides guidelines for integrating a high-speed USB host controller onto a 4-layer desktop motherboard. It covers board design, EMI/ESD, and front panel USB guidelines.

Requirements and Recommendations for USB Products with Embedded Hosts and/or Multiple Receptacles (.pdf file format, size 289k) will assist developers of products that don't fall into the traditional categories of host, hub or peripheral. An ever-increasing number of USB peripherals are being designed with more than a single device port, some including host ports that are intended to support only a limited set of peripherals.

USB-IF Compliance is expanding its coverage to ensure more complete testing of these types of products.

USB-IF Compliance Test Procedures

Compliance Test Procedures for High-Speed USB Products

Each set documents the high-speed electrical tests required for the compliance program. Please determine which set of procedures meet your need based on your test equipment choice.NOTE:  Some of the following approved test solutions use proprietary software to assess signal quality and inrush current events.  The only official analysis tool for certifying signal quality and inrush current is USBET20 published by the USB-IF.  Please be sure to run captured signal quality and inrush current test data through USBET for an official assessment of the measurement.

High-speed Electrical Test Procedures for Tektronix TDS7254/B, TDS7704/B, CSA7404/B, TDS6604/B, TDS6804/B, TDS6404, DPO7254, DPO7354, and DPO/DSA70000 series

• Device High-speed Electrical Test Procedure (pdf, 1,548k) - for Tektronix Test Equipment
• Hub High-speed Electrical Test Procedure (pdf, 2,183k) - for Tektronix Test Equipment
• Host High-speed Electrical Test Procedure (pdf, 1,069k) - for Tektronix Test Equipment
• Tektronix Test Equipment Setup files (zip, 21k) - for Tektronix Test Equipment

High-Speed Electrical Test Procedures for Tektronix Test Equipment TDS 694C, DG2040 (Version 1.0)

• Device High-speed Electrical Test Procedure (pdf, 623k) - for Tektronix Test Equipment
• Hub High-speed Electrical Test Procedure (pdf, 1,571k) - for Tektronix Test Equipment
• Host High-speed Electrical Test Procedure (pdf, 1.63MB) - for Tektronix Test Equipment
• Tektronix Test Equipment Setup files (zip, 35k) - for Tektronix Test Equipment

High-Speed Electrical Test Procedures for Agilent Test Equipment 54853, 54854, and 54855 (Version 1.2)

• Device High-speed Electrical Test Procedure (pdf, 2.67MB) - for Agilent Test Equipment 5485x
• Hub High-speed Electrical Test Procedure (pdf, 4.54MB) - for Agilent Test Equipment 5485x
• Host High-speed Electrical Test Procedure (pdf, 2.66MB) - for Agilent Test Equipment 5485x
• Agilent Test Equipment Setup files (zip, 34.9k) - for Agilent Test Equipment 5485x

High-Speed Electrical Test Procedures for Agilent Test Equipment 54846 and 1131 (Version 1.1)

• Device High-speed Electrical Test Procedure (pdf, 1.37MB) - for Agilent Test Equipment 54846
• Hub High-speed Electrical Test Procedure (pdf, 2.46MB) - for Agilent Test Equipment 54846
• Host High-speed Electrical Test Procedure (pdf, 1.31MB) - for Agilent Test Equipment 54846
• Agilent Test Equipment Setup files (zip, 26.7k) - for Agilent Test Equipment 54846

High-Speed Electrical Test Procedures for Agilent Test Equipment (Version 1.0)

• Device High-speed Electrical Test Procedure (pdf, 549k) - for Agilent Test Equipment
• Hub High-speed Electrical Test Procedure (pdf, 910k) - for Agilent Test Equipment
• Host High-speed Electrical Test Procedure (pdf, 734k) - for Agilent Test Equipment
• Agilent Test Equipment Setup files (zip, 29k) - for Agilent Test Equipment

High-Speed Electrical Test Procedures for Agilent Test Equipment DSO80000A/B series, 548XXA series, Infiniium 90000 series and Infiniium 9000 series oscilloscopes using the N5416A USB 2.0 Compliance Test SW.

• Device, Hub and Host Electrical Test Procedures (pdf, 5MB) - for Agilent Test Equipment

High-Speed Electrical Test Procedures for LeCroy Test Equipment WaveRunner, WavePro, WaveMaster and SDA using QualiPHY USB

• QualiPHY USB Manual (pdf, 6.3MB) - for LeCroy Test Equipment
• QualiPHY USB datasheet (pdf, 0.8MB) - for LeCroy Test Equipment
• QualiPHY Main Manual (pdf, 1.8MB) - for LeCroy Test Equipment
• QualiPHY datasheet (pdf, 0.6MB) - for LeCroy Test Equipment
• Software can be downloaded from here: http://www.qualiphy.com
  

High-Speed Electrical Test Procedures for LeCroy Test Equipment WaveMaster and SDA (Version 1.0)

• Device High-speed Electrical Test Procedure (pdf, 2.65MB) - for LeCroy Test Equipment
• Hub High-speed Electrical Test Procedure (pdf, 4.90MB)) - for LeCroy Test Equipment
• Host High-speed Electrical Test Procedure (pdf, 2.80MB) - for LeCroy Test Equipment
• LeCroy Test Equipment Setup files (zip, 84k) - for LeCroy Test Equipment

High-Speed Electrical Test Procedures for Yokogawa Test Equipment DL9240/DL9240L/DL6154 (Version 2.0)

• Device High-speed Electrical Test Procedure (zip, 1.74MB) - for Yokogawa Test Equipment
• Hub High-speed Electrical Test Procedure (zip,  2.57MB) - for Yokogawa Test Equipment 
• Host High-speed Electrical Test Procedure (zip, 1.29MB) - for Yokogawa Test Equipment

High-Speed Electrical Test Specification (Version 1.03)

The High-Speed Electrical Test Specification (pdf, 194k) defines a set of electrical test criteria for USB 2.0 products. The compliance criteria are provided as a list of test assertions that describe specific characteristics or behaviors that must be met for USB 2.0 new silicons. Many though not all of the assertions are verified in the high-speed electrical test procedures.

USB High-Speed Electrical Test Tool

The USB High-Speed Electrical Test Tool is a test utility designed to facilitate the high-speed electrical tests. This test utility is required to perform each of the high-speed electrical test procedures. The USB High Speed Electrical Test Tool is a part of the USB High-Speed Electrical Test Tool Kit installation USBHSET.MSI which also including the setup instruction for configuring a High-Speed Signal Quality Analysis Computer and a High-Speed Electrical Test Bed Computer. Included in this installation are also GPIB-DAQ and the Matlab USB analysis script. This tool kit is provided in courtesy of Intel� Corporation.

USB-IF Full and Low Speed Electrical and Interoperability Compliance Test Procedure

This USB-IF Compliance Test Procedure (pdf, 1.3MB) was developed for all USB products before the advent of high-speed USB products. It documents the required compliance test of full-speed and low-speed signal quality, power delivery. Full speed electrical tests still apply to high speed devices. It documents interoperability tests for all device speeds. These tests are required for high-speed, full-speed, and low-speed USB products. The high speed electrical tests are documented in the USBHSET installation package. This document was updated on February 9, 2004.

USB-IF Embedded Host Compliance Procedures

Embedded hosts may be certified provided they meet specific criteria. The document, "USB-IF Embedded Host Compliance Plan, Revision 1.0, August 2006" defines the test criteria and rules for embedded hosts.

A High-speed Embedded Host Electrical Test device (HSEHET) made specifically for initiating these test modes is available.  The HSEHET device may be used as an alternative to the OPT for initiating test modes on embedded hosts.  Please see the HSEHET webpage for ordering information.

Compliance Updates

Please review the USB-IF Compliance Updates webpage frequently and subscribe to the news feed for the latest information regarding the USB-IF Compliance Program.

USB Current Adapters

The USB-IF is providing a limited number of USB current adapters to USB-IF member companies while supplies last.

LANGID Codes

A USB device can store strings in multiple languages. i.e. the string index defines which word or phrase should be communicated to the user (like "Format" or "Insert Disk") and the LANGID code identifies to a device, which language (German, Chinese, etc.) to retrieve that word or phase for. Here is a list of LANGIDs (.pdf file format, size 34k) defined for USB devices.

Note: To support forward compatibility, system software must allow the enumeration and selection of LANGIDs that are not currently on this list. And system software should never request a LANGID not defined in the LANGID code array (string index = 0) presented by a device.

Presentations

Presentations from our past conferences are downloadable from this page in case you have not been able to attend.

White Papers

There are USB technical "White Papers" on various topics written by the Spec authors and other industry experts. These are provided as additional guidance and do not constitute official USB-IF collateral.