SoC
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Growing the pie: Eclipse-based Windows IDE gives more access to RISC-V developers
The RISC-V community received a significant boost last week, and while it has to do with Windows, it’s still based on open source. Microsemi announced Thursday that the latest version of its free Eclipse-based integrated development environment (IDE), SoftConsole 5.1, now supports RISC-V development on Windows 7 and 10 operating systems (OSs). SoftConsole is the [...]
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Embedded vision for Industry 4.0
Machine vision is a term commonly used for embedded vision systems operating in an industrial context. Consequently, machine vision addresses a wide range of applications, from optical inspection of manufactured goods such as semiconductor and solar panel manufacturing to postal and parcel sorting, industrial X-rays, and food packaging. There are several high-level trends facing [...]
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Switching up the equation to optimize energy efficiency of SoC designs
It wasn’t long ago when power was a distant third in the power, performance, and area triad of system-on-chip (SoC) design concerns. In the last few years, power has risen quickly as a critical concern driving SoC designs. Performance can be analyzed through virtual platforms, the abstract modeling of hardware prototyping. Area can be easily [...]
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Breker Verification Systems to Demonstrate Implementation of Accellera Portable Stimulus Draft Standard During DAC
Will Showcase its C++ Contribution to Standardization Effort, Displaying Practical Verification Proficiency
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Accellera Portable Stimulus Early Adopter Specification Now Available for Public Review
Draft standard to specify verification intent and behaviors reusable across multiple target platforms
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Functional safety, AI collide in automotive behind heterogeneous MIPS core
When I think of functional safety in the context of processing, I usually think of a small microcontroller (MCU) responsible for one or two dedicated tasks. Its architecture is probably simple yet resilient in order to reduce the possibility of hardware faults and soft errors. This has been the case for safety-critical industrial and [...]
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Real Intent's New Verix Product Family Delivers First Intent-Driven Multimode RTL Sign-off of SoC Designs
Brings New Levels of Innovation and Productivity to IC Design Teams through Enhanced Speed, Analysis, and Debug
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MEDIA ALERT: Oski Technology DAC Demonstrations to Showcase New VIP Library for AMBA Interface Protocols, Oski Formal Sign-Off
"New Frontiers in Formal Verification" Design/EDA Track Session Will Include Oski, ArterisIP Presentation "Architectural Formal Verification of Cache Coherent Protocols"
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Cortus Presenting at the SIPO IoT Forum Taipei, Taiwan on 20th June 2017 and the NKIC Seminar at Nan-Kang Incubation Center , Taipei, Taiwan, on the 22nd June 2017
Drawing on their experience with customers in the IoT area Cortus will share the typical challenges that are faced when implementing IoT solutions. From the obvious low power requirements to the less obvious impact of code density but also including the various, sometimes contradictory, aspects of security.
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Multi-protocol wireless and a crossroads in industrial IoT networking
The industrial networking landscape has reached a crossroads as standard protocols begin to eat into traditionally proprietary environments. However, as we’ve seen over the years, there is no such thing as a “one size fits all” networking solution, especially considering the installed base of systems that rely on specialized protocols to communicate. Where does this [...]
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ARM redefines microarchitecture, IP for AI era
Like everything else in technology to date, smarter systems based on artificial intelligence (AI) require smarter processors. Several approaches to processing machine learning inferencing algorithms (the act of making decisions based on learned patterns that will be performed largely at the network edge) have been adopted thus far, including the use of CPUs, GPUs, [...]
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Skyworks' Latest Bluetooth(r) Low Energy/802.15.4/Thread/ZigBee(r) Front-End Module
SKY66113-11 Front-end Module for IoT
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New Open Virtual Platforms Processor Models for ARM, Imagination Technologies, RISC-V and Renesas Accelerate Software Development
Latest OVP Models and Virtual Prototype Software Release with iGen, Available Now
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New Imperas Virtual Platform Software Delivers Performance and Models for Automotive, IoT and Security
New Release Doubles Performance, Adds ARM, Imagination Technologies, RISC-V and Renesas Models, Features Virtual Prototype Modeling Tool
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Austemper Design Systems Launches Comprehensive Functional Safety Tool Suite
End-to-End Tool Suite Analyzes, Augments, Verifies Functional Safety of SoC, ASIC, IP Designs
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Verific Signs Licensing Agreement with Functional Safety Solutions Provider Austemper Design Systems
Parser Platform Serves as Front End to Austemper's Functional Safety Tool Suite
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288 Core ARM(r) and 13'824 CUDA core microserver cluster with Toradex Apalis System on Modules by Christmann
RECS(r)|Box Atlas Quad Apalis, evaluation platform for up to 4 Apalis modules Toradex is excited to welcome Christmann Informationstechnik + Medien GmbH & Co. KG from Germany in its partner program. Christmann is offering the RECS(r)|Box Atlas Quad Apalis Evaluation platform, and the RECS(r)|Box Antares and Arneb 19" 1RU server enclosures which can run 24 and 72 Apalis System on Modules respectively in a cluster configuration.
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Driving Wi-Fi, zigbee, and Thread coexistence in the 2.4 GHz band, part 1: Unmanaged coexistence
Wireless coexistence studies and mitigation technologies for unlicensed 2.4 GHz frequency bands have been around for at least 20 years. The issue is that different 2.4 GHz wireless technologies meet different needs for the same devices, and therefore must operate simultaneously without noticeable performance degradation. This two-part article discusses the growing need for a [...]
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RISC-V Gains a Software Development Solution from Imperas
Imperas Joins RISC-V Foundation: Virtual Platforms and Models Now Available, Demonstrations at the 6th RISC-V Workshop in Shanghai, China and the 2017 Design Automation Conference
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Analog Devices and Renesas Electronics collaborate on 77/79-GHz automotive radar technology to improve ADAS, enable autonomous vehicles
A new demonstrator combines two cutting-edge technologies that include the RH850/V1R-M microcontroller (MCU) from the Renesas autonomy Platform and ADI's Drive360 advanced 28nm CMOS RF-to-bits technology.
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The Electronic System Design Alliance Welcomes SoC Solutions as Newest Member
Notes Value in Being Part of Organization that Promotes System Design Ecosystem
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Energy consumption in modern microcontroller systems
Is there a strategy that can be applied to both IP-based and standard semiconductor products that will allow device users to control energy consumption in a manner that is simple and reliable, that will give the user full visibility into operation, and that can maintain safe and secure conditions? Improved results can come with an [...]
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Intel's Mobileye deal marks an inflection point in automotive electronics
In summer 2016, when BMW, Intel, and Mobileye joined hands to bring fully autonomous cars to roads by 2021, the collaboration raised a few questions. For instance, what is Intel doing in this alliance without an automotive chip? And why would Mobileye share its renowned machine-vision algorithm with a chipmaker? The answer came in March [...]
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DesignCore(tm) RVP-TDA2x Development Kit supports high-end ADAS technology evaluation under realistic on-vehicle conditions
D3 Engineering's 8-channel SerDes Rugged Vision Platform features Texas Instruments TDA2x vision processor and 3GHz FPD-Link III SerDes interface
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Improving memory performance in SoC designs
No matter how new, fast, or high-performance an electronic device is touted to be, there’s always a slight, almost imperceptible lag between a request from the user and the device’s response. That’s the memory doing its job at an 80 percent or lower efficiency rate. Of course, the user still considers the device to be [...]
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New Embedded Imaging Kit for Basler Dart at SPIE DCS
Get a sneak preview of the new MitySOM embedded imaging solution. Visit Critical Link booth #219 at SPIE DCS in Anaheim, April 11-13.
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SECO's roadmap from NXP i.MX 6 to i.MX 8M
Amongst the most important innovations, SECO introduces an updated version of its Q7-928, a Qseven(r) standard module featuring the NXP(r) i.MX 6DualPlus applications processor that offers top computational and graphical performances given by the low-power consuming ARM architecture. The i.MX 6DualPlus processor is also an option for the SBC-A62-J, a low-end Single Board Computer that exploits the potential of a configurable expansion connector to fully meet the configuration flexibility needs. Both solutions can now benefit from the increased performances and enhanced 3D graphics delivered by the i.MX 6DualPlus processor.
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Zynq(r) Ultrascale +(tm) at the heart of the research for new SW & HW architectures for smart Cyber Physical Systems
SECO introduces the first prototype of AXIOM project's programmable hybrid ARM/FPGA solution based on Zynq Ultrascale.
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Defining (artificial) intelligence at the edge for IoT systems
Merriam-Webster defines intelligence as “the ability to learn or understand or to deal with new or trying situations.” By that definition, “intelligent systems” on the Internet of Things (IoT) require much more than just an Internet connection. As more IoT devices come online, machine intelligence will increasingly be classified as a system’s ability to [...]
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2017 embedded wireless landscape: LPWA standards seek Industrial IoT connections
Shortly after acquiring semiconductor IP vendor ARM last fall, Softbank CEO Masayoshi Son predicted a future with 1 trillion connected devices. Although it’s unclear exactly how Son reached that number, what is undeniable is that, however many devices are eventually connected, the majority will belong to the Industrial IoT (IIoT). Meanwhile, telecom companies in [...]
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embedded world 2017: Imagination Technologies MIPS, PowerVR, Ensigma Drive Company into Automotive
At embedded world 2017, Rich Nass, Executive Vice President of Embedded Computing Design met up with Bryce Johnstone, Senior Manager of 3rd Party Relationships at Imagination Technologies. At the company’s booth in Hall 4, Booth 629, Bryce walks Rich through how Imagination’s MIPS, PowerVR, and Ensigma wireless technologies allow them to attack the networking, automotive, [...]
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embedded world 2017: Digi-Key Development Kits – Cypress Semiconductor PSoC-based CY8CKIT
Rich Nass of Embedded Computing Design tours embedded development kits on display at embedded world 2017 at the Digi-Key booth (Hall 4A, Booth 631). Raul Hernandez Arthur of Cypress Semiconductor introduced the PSoC-based CY8CKIT there, which is uniquely packaged for iterative, modular prototyping. [youtube=https://www.youtube.com/watch?v=NM4qEfKE9JU]
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embedded world 2017: Digi-Key Development Kits – Texas Instruments LaunchPad, BoosterPack
Rich Nass of Embedded Computing Design tours embedded development kits on display at embedded world 2017 at the Digi-Key booth (Hall 4A, Booth 631). In one meeting, Rich met with Mattias Lange, GM of Embedded Connectivity Solutions at Texas Instruments, who showcased his company’s LaunchPad and Booster Pack development kit solutions. [youtube=https://www.youtube.com/watch?v=fug-eBGJgtk]
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embedded world 2017: ARM TrustZone Community to Drive Security Education for -M-Class Devices
Thomas Ensergueix, Director of Product Marketing for the CPU Group at ARM, reviews some of the highlights of the semiconductor IP company over the past year during an interview with Brandon Lewis, Technology Editor, Embedded Computing Design at embedded world Hall 3, Booth 342. Among his cliff notes is a peak at the first Cortex-M [...]
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embedded world 2017: A DesignStart from ARM for SoC design
In the second of two video interviews at the ARM booth (Hall 3, Booth 342) at embedded world 2017, Embedded Computing Design Technology Editor Brandon Lewis meets with Phillip Burr, Senior Product Marketing Manager at ARM to discuss the company’s DesignStart program. DesignStart allows system on chip (SoC) developers to accelerate their chip design process, [...]
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Meet BeagleBone® Blue. Robots. Fast.
BeagleBone® Blue is the affordable and complete robotics controller built around the popular BeagleBone® open hardware computer. Linux-enabled, Blue is community-supported and fully open-source. High-performance, flexible networking capabilities are coupled with a real-time capable Linux system and a compelling set of peripherals for building mobile robots quickly and affordably. By utilizing the pre-configured Wi-Fi access [...]
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Understand why system architects are implementing HMP systems for embedded applications
We encounter more and more compute systems every day, starting with the smartphone and the smart watch tethered to it. In our homes, we interact with smart and connected televisions, refrigerators, washing machines, and thermostats. In the gym, smart and connected equipment is becoming the norm. All are transforming the way we live for [...]
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The Embedded Insiders Podcast: Survey Says!
In this episode of the newly rebranded Embedded Insiders podcast, Executive Vice President Rich Nass and Technology Editor Brandon Lewis review results from Embedded Computing Design’s 2016 reader survey in which embedded and Internet of Things (IoT) engineers responded to a number of questions related to development practices and trends. After looking at the year-over-year [...]
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embedded world 2017: Reconfigurable vision-guided systems on display from Xilinx
SAN JOSE, CA. At embedded world 2017in Nuremberg, Germany, Xilinx, Inc. will demonstrate responsive and reconfigurable vision-guided systems based on tools and libraries that integrate machine learning, computer vision, and connectivity. The demonstrations, prepared by Xilinx and partner organizations, span applications that include industrial machine vision, advanced driver assistance systems, Internet of Things (IoT) gateways, [...]
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Cybersecurity for connected consumer devices: A lack of standards, expertise
Connected consumer devices have been commandeered recently during multiple cyber attacks, largely because immense cost pressures have limited the use of satisfactory security technologies and development practices. However, as the large organizations targeted by these attacks experience economic loss, Bernard Vachon, Director of Embedded Software Engineering at embedded design services firm Cardinal Peak forecasts that [...]
Brandon Lewis, Technology Editor
Nick Ni, Xilinx
Andy Ladd, Baum
Breker Verification Systems
Brandon Lewis, Technology Editor
Cortus S.A.S.
Brandon Lewis, Technology Editor
Skyworks Solutions, Inc.
Austemper Design Systems
David Egan, Silicon Labs
ESD Alliance
Horst Diewald, ProJoule GmbH
Majeed Ahmed, Automotive Contributor
D3 Engineering
Gregg Recupero, Performance-IP
Critical Link, LLC
Brandon Lewis, Technology Editor
Rich Nass, Embedded Computing Brand Director
Rich Nass, Embedded Computing Brand Director
Kinjal Dave, Senior Product Manager, ARM