IP
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Growing the pie: Eclipse-based Windows IDE gives more access to RISC-V developers
The RISC-V community received a significant boost last week, and while it has to do with Windows, it’s still based on open source. Microsemi announced Thursday that the latest version of its free Eclipse-based integrated development environment (IDE), SoftConsole 5.1, now supports RISC-V development on Windows 7 and 10 operating systems (OSs). SoftConsole is the [...]
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MEDIA ALERT: Mobiveil to Exhibit at DAC in Avery Design Systems' Booth, Showcasing Portfolio of IP, Platforms, Solutions for Storage, IoT, Networking, Enterprise Markets
Highlights Longstanding Avery/Mobiveil Partnership
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Uniquify's LPDDR4 Super Combo Interface IP in Volume Production at 28nm Low-power Node
IP Guru Will Answer DDR Questions at DAC Booth; Uniquify "Stars of IP" Sponsor
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ARM redefines microarchitecture, IP for AI era
Like everything else in technology to date, smarter systems based on artificial intelligence (AI) require smarter processors. Several approaches to processing machine learning inferencing algorithms (the act of making decisions based on learned patterns that will be performed largely at the network edge) have been adopted thus far, including the use of CPUs, GPUs, [...]
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New Open Virtual Platforms Processor Models for ARM, Imagination Technologies, RISC-V and Renesas Accelerate Software Development
Latest OVP Models and Virtual Prototype Software Release with iGen, Available Now
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New Imperas Virtual Platform Software Delivers Performance and Models for Automotive, IoT and Security
New Release Doubles Performance, Adds ARM, Imagination Technologies, RISC-V and Renesas Models, Features Virtual Prototype Modeling Tool
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Bluetooth audio streaming is everywhere and improving
Audio devices using Bluetooth (BT) connectivity are becoming more ubiquitous than ever. Apple, among others, have eliminated the standard 3.5mm audio jack from their designs, inducing more consumers to switch to wireless BT headphones. From portable speakers and car infotainment systems to earphones and hearing aids, the Advanced Audio Distribution Profile (A2DP) is by far [...]
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Moortec and UltraSoC collaborate to enable next-generation "smart" PVT sensors
CAMBRIDGE, United Kingdom, 12th April 2017: UltraSoC and Moortec Semiconductor today announced that they are cooperating on system-on-chip (SoC) monitoring and analytics intellectual property (IP) to enable a new generation of Process, Voltage and Temperature (PVT) sensor sub-systems.
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Improving memory performance in SoC designs
No matter how new, fast, or high-performance an electronic device is touted to be, there’s always a slight, almost imperceptible lag between a request from the user and the device’s response. That’s the memory doing its job at an 80 percent or lower efficiency rate. Of course, the user still considers the device to be [...]
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efabless, X-FAB Announce Results of First Analog-on-Demand Design Challenge
Winning Designs Judged by Lowest Power Dissipation
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ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX(r) Technology Platform
Leading-edge I-fuse(tm) brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications
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embedded world 2017: Imagination Technologies MIPS, PowerVR, Ensigma Drive Company into Automotive
At embedded world 2017, Rich Nass, Executive Vice President of Embedded Computing Design met up with Bryce Johnstone, Senior Manager of 3rd Party Relationships at Imagination Technologies. At the company’s booth in Hall 4, Booth 629, Bryce walks Rich through how Imagination’s MIPS, PowerVR, and Ensigma wireless technologies allow them to attack the networking, automotive, [...]
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Understand why system architects are implementing HMP systems for embedded applications
We encounter more and more compute systems every day, starting with the smartphone and the smart watch tethered to it. In our homes, we interact with smart and connected televisions, refrigerators, washing machines, and thermostats. In the gym, smart and connected equipment is becoming the norm. All are transforming the way we live for [...]
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Automotive Ethernet for vision-based ADAS: Loss, cost, and latency
Automotive Ethernet is slowly but surely making its way into next-generation vehicle designs, but increasingly those designs also include advanced safety systems that require minimal latency. For the camera systems associated with these advanced driver assistance system (ADAS) functions, the image buffering, encoding, and decoding requirements of Ethernet could potentially have negative consequences on [...]
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QuickLogic Announces ArcticPro(tm) Ultra-Low Power Embedded FPGA IP Licensing Initiative
QuickLogic Corporation selectively license its proprietary ultra-low power programmable logic technology under the trade name ArcticPro(tm) eFPGA.
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efabless Unveils Online Community to Reimagine Chip Design
Analog/Mixed-Signal Design Initial Focus; Cost-Effectively Addresses Spec to Prototype
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RISC-V SoC development toolkit released by Codasip, UltraSoC
Semiconductor IP vendors Codasip and UltraSoC have announced plans to integrate Codasip’s Codix-Bk series of RISC-V-compliant processor cores with the UltraSoC debug, analysis, and bring up environment to reduce development time for system on chip (SoC) developers designing with the RSIC-V instruction set architecture (ISA). Rather than adapt legacy SoC development solutions, the RISC-V-optimized implementation [...]
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Espressif Licenses and Deploys CEVA Bluetooth in ESP32 IoT Chip
Espressif's new Wi-Fi/Bluetooth Combo chip leverages RivieraWaves Bluetooth 4.2 dual mode IP
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EnSilica opens specialist Design Center for RF and low power sensing applications
New facility is headed by Alan Wong, formerly IC Design Director at Frontier Microsystems and extends EnSilica's skills-base, addressing the needs of wireless connected IoT and wearable products
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Serial FPDP IP Core
Serial Front Panel Data Port (sFPDP) is an industry standard, low-overhead, low-latency, high speed serial communications protocol. sFPDP is ideal for use in applications such as Radar, Range & Telemetry Systems, High Speed Data Acquisition, High Resolution Video Storage Applications, Digital Receivers, Spectrum and Transient Analysis. sFPDP overcomes the major limitation of the Parallel FPDP which is limited link connection distance - not more than 5 meters, & is capable of covering up to 10 Kilometres using appropriate optical transceiver and fibre optic cable. The simple and lightweight nature of the protocol also makes it an attractive choice for replacement of parallel bus interconnects using transceiver technology. iWave has been closely working with the customers worldwide to satisfy their design and development needs. iWave's sFPDP IP core found perfect stage to showcase its utilization and has been a part of major applications. iWave's development of the sFPDP IP core has been meeting the market demands ever since.
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Cortus Launches High Performance Dual-Issue IP Core for Embedded Applications
New APS core from Cortus delivers high performance for embedded System-on-Chip applications
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Accelerate SHA-3 Cryptographic Hash Processing with New Hardware IP Core
A new intellectual property core supports the latest standard for protecting the integrity of electronic transmissions, Secure Hash Algorithm-3 (SHA-3), in a flexible, high-throughput, area-efficient hardware accelerator.
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MEDIA ALERT: Oski Technology's Vigyan Singhal to Participate in Panel During IEEE's HLDVT Workshop
Discussion Will Highlight Increasing Use of Formal Verification
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CEVA DSP brings AI, deep learning compute performance to low-power embedded devices
SANTA CLARA, CA. CEVA, Inc. today introduced the CEVA-XM6-based vision platform, a digital signal processor-based (DSP-based) offering that brings deep learning and artificial intelligence (AI) capabilities to low-power embedded systems. The CEVA-XM6 imaging and vision DSP is the centerpiece of an integrated hardware and software silicon IP platform that allows developers to harness neural networks [...]
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Imagination licenses UltraSoC IP to deliver system-level debug and optimization capabilities for SoCs
UltraSoC today announced that Imagination Technologies (IMG.L) has licensed the full range of UltraSoC semiconductor IP and software, enabling Imagination to help customers integrate sophisticated monitoring, analytics and security capabilities into system-on-chip (SoC) designs.
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Sophisticated Power Management IC Pushes Performance Envelope & Enables More Effective Energy Harvesting
Following its arrival on the power semiconductor scene earlier this year, e-peas today announces commercial availability of its first IC.
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OATI advances IoT security for smart grid devices with GridSafe process
Open Access Technology International, Inc. (OATI) announces its latest patent for GridSafe, a new process that allows smart grid devices to securely communicate over the internet and IP networks.
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Taking industrial display interfaces beyond FPGAs and closed systems
Image resolution in industrial control, surveillance, and healthcare systems continues to move from 720p HD to 1080p FHD and 4K UHD and beyond. As display resolution has progressed, it has also become sensible for medical and industrial OEMs that rely on high-resolution video to look for new cost-effective imaging solutions that allow for rapid upscaling [...]
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Software forensics lay MS-DOS, CP/M controversy to rest
It’s often the case that success breeds controversy, particularly in the technology industry and especially with regards to software. Given the amount of code sharing and reuse that has occurred in since the beginnings of the tech industry itself, it’s not uncommon anymore to hear about legal actions being taken around copyright infringement or licensing [...]
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Movidius licenses UltraSoC analytics IP to speed debug and development
UltraSoC and Movidius today announced a licensing agreement under which Movidius will incorporate UltraSoC's semiconductor IP into its next-generation low-power machine vision systems-on-chip (SoCs).
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The Thread Group’s liaison agreements will benefit the connected home
Thread is a networking protocol. Period. This networking technology provides key benefits to the market such as being based on Internet Protocol (IP) for a unified convergence layer across all networks in the home; supporting low-power operation for extended battery life; implementing mandatory security to address privacy and security concerns; and providing a robust network [...]
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MIPI Alliance Releases MIPI Gigabit Debug For IP Sockets
Part of the MIPI Gigabit Debug family, MIPI GbD for IPS offers convenience and versatility, enabling companies to debug devices during development and again after products are commercialized and connected to networks. The specification can be used to debug all types of connected devices, from smartphones to end points on the Internet of Things (IoT).
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IoT Roadshow, Silicon Valley – Sonics: Power thrashing, the need for speed, and idle power management
Energy efficiency is almost synonymous with cost these days in the tech industry, particularly with the influx of resource-constrained Internet of Things (IoT) devices operating on battery power (or less). Power consumption for these devices can be the difference between profitable margins and sending technicians into the field to replace a coin cell, or consumers [...]
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HCC Embedded acquires networking business of InterNiche Technologies to offer IoT device developers a single source of secure networking and storage solutions
HCC expands TCP/IP networking stack portfolio and strengthens U.S. technical and sales presence
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IoT Roadshow, Austin – Synopsys: Integrated IoT SoCs start with a variety of IP and the right core
What’s most important in an Internet of Things (IoT) edge processor? Energy efficiency? Integrated wireless? Security? Performance? What type of sensors inputs, security, and connectivity should be included? The answer to all of the above is, “It depends what you’re building.” In the last few years we have seen an increasing trend towards highly integrated, [...]
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Open source opens many licensing issues for 3D printing
The use of additive manufacturing – commonly referred to as 3D printing – by manufacturing companies, retailers, and others is rising exponentially. PwC’s April 2016 report, “3D Printing Comes of Age in US Industrial Manufacturing[1]” confirms that 71 percent of manufacturers already have adopted 3D printing and that 52 percent expect to use it [...]
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Trends and tradeoffs of implementing multi-standard wireless in IoT devices
While Internet of Things (IoT) device manufacturers have a growing number of connectivity options when defining next-generation systems, misjudgment of the fast-changing network landscape can leave those products off the grid, literally. This has led many to hedge their bets by supporting multiple wireless standards in the same system-on-chip (SoC), which helps safeguard against [...]
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EnSilica launches Kalman Filter acceleration IP core for advanced driver assistance systems (ADAS)
Supports both classical and extended Kalman filtering, conforms to process guidelines for ISO26262 functional safety requirements and releases valuable CPU resources from computationally demanding processing tasks.
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Flex Logix Announces Program For Fast-track Evaluation And Prototyping
Reconfigurable RTL Enables One Design to Serve Varying Customer Requirements
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CEVA Accelerates Machine-to-Machine System Design with Communication Reference Platform
CEVA's Dragonfly(tm) reference platform reduces time-to-market for power and cost-sensitive IoT and M2M devices supporting low-data rate connectivity, including LTE Cat-1, Cat-0, Cat-M and NB-IoT standards
Brandon Lewis, Technology Editor
Mobiveil
Brandon Lewis, Technology Editor
Franz Dugand, CEVA
Gregg Recupero, Performance-IP
efabless
ATTOPSEMI TECHNOLOGY
Rich Nass, Embedded Computing Brand Director
Kinjal Dave, Senior Product Manager, ARM
Brandon Lewis, Technology Editor
Barbara Quinlan
efabless
Embedded company
Cortus S.A.S.
Jamie Leland, Content Assistant
e-peas
OATI
Anthony Wong, Socionext America, Inc.
Brandon Lewis, Technology Editor
Sujata Neidig, Vice President of Marketing, Thread Group
Maya M. Eckstein, JD, Hunton & Williams LLP
Eric J. Hanson, JD, Hunton & Williams LLP
Flex Logix