EMD Electronics

AI is transforming industries at remarkable speed — but behind every breakthrough model, data center and intelligent device is a foundation that often goes unseen: materials innovation.   As AI workloads become more powerful and energy-intensive, the hardware that supports them must evolve just as quickly. That means new demands for high-performance semiconductors, advanced packaging, thermal management and materials engineered for greater speed, efficiency and reliability.   In this attributed article, we highlight how chemistry is helping power AI’s next leap — enabling the hardware breakthroughs needed to move from possibility to performance.   Read the article by Sergei Ivanov, our Metallics Business Technology Director, on AI Technology Insights: https://lnkd.in/ehPVK9XW   #AI #MaterialsScience #Semiconductors #AdvancedPackaging #ThermalManagement #Electronics #Innovation

Beyond the AI boom, the biggest question for the semiconductor industry may be more foundational: can the materials ecosystem scale fast—and responsibly—enough to support what’s next? At Strategic Materials Conference 2026, we are proud to have Lu Gan and Katherine Hutchison participating in Session 2: Materials for Scalable AI Systems on July 14. In Kate's presentation “Materials Discovery in the Era of Scientific Super Intelligence,” you’ll hear how AI is evolving from pattern recognition to an active collaborator in discovery—helping teams form stronger hypotheses from massive datasets, accelerate simulations, prioritize the right experiments, and connect automated labs into more reproducible workflows—with human insight and accountability at the center. If you’ll be at SMC, we’d love to connect—see you there! 💡 Materials Discovery in the Era of Scientific Super Intelligence 🎤 Speaker: Katherine Hutchinson 📅 July 14 | 1:20–1:50 PM PDT 📍 Hayes Mansion | San Jose, CA 🌐https://lnkd.in/edqmfm2P #Semiconductors #MaterialsScience #MaterialsInnovation #AI #AdvancedPackaging #SMC2026

Last week's AVS #ALDALE2026 in Tampa, FL, was a strong moment for us—where technical credibility meets customer impact. Across the week, our teams delivered six technical presentations and had high-value conversations with customers, OEMs, and research partners on what’s next in precursor design, ultrathin/high‑k dielectrics, metallics, area‑selective deposition, and next‑generation materials integration. The message we heard clearly: the industry is pushing for solutions that combine precision, manufacturability, and integration readiness—and it was energizing to see our data and roadmap discussions resonate. We’re taking these insights straight back into our collaboration with customers and partners—helping translate breakthrough materials science into solutions that are integration-ready. A sincere thank you to every colleague who contributed through presentations, customer engagements, planning, and flawless execution. Your dedication, expertise, and teamwork made this a truly successful and impactful week. #Semiconductors #AdvancedMaterials #ThinFilms #AtomicLayerDeposition #Innovation American Vacuum Society (AVS)

We’re heading to the AVS 26th International Conference on Atomic Layer Deposition—and we’d love to connect with the #ALDALE community in Tampa, Florida!🙌 Join us at the Welcome Reception sponsored by us 📅 Sunday, June 28 | 🕕 18:00–20:00 🍸 Drinks + great conversations 🎒 Chance to win a backpack! Sign up here: https://lnkd.in/e2VQDttQ At the conference, you can also explore our presentations below and talk with our experts about how our broad thin-film portfolio—spanning ALD/CVD metals, dielectrics, and spin-on dielectrics—can help elevate your technology and support next-generation device performance. If you’ll be at #ALDALE2026, drop a comment or message us to meet up! #thinfilms #dielectrics Tianniu (Rick) Chen Haripin Chandra Jan-Lucas Wree Taylor Hayes Nguyen Vu Son Hoang Jared McWilliams Andrew Kaye American Vacuum Society (AVS)

Pioneering the next wave of interconnects and leading the way in 2.5D/3D integration at  International Interconnect Technology Conference #IITC 2026 in San Jose, CA. Our experts will present: 💡Ultrathin ALD Pt: Breaking the Thickness-Continuity Limit — Hsien-chieh (Jay) Chiu 💡CMP Slurry Design for Thick Copper: Enabling High-Performance CMP — Dnyanesh Tamboli Join us Jun 3, 17:30–19:30 for cutting-edge interconnect research. See you there! #IITC2026 #Interconnects #2_5D_3D #ULSI #IEEEEDS

AI is driving an unprecedented semiconductor build-out—and keeping pace takes more than any one company. It takes an ecosystem. That’s why our company brought partners and cross-functional teams together in Phoenix, Arizona for our first on-the-road Supplier Summit—aligning on what matters most: speed, quality, resilience, and competitiveness. From executive keynotes and customer perspectives to focused 1:1 working sessions, we moved beyond “buyer–supplier” and built a shared mindset around growth—turning alignment into a pipeline of concrete follow-ups. Thank you to every partner and colleague who helped make this possible. This was the starting point, not the finish line. #Semiconductors #AI #SupplyChain #Partnerships #Innovation #SupplierDay

Proud to have joined the SEMI #Arizona Forum (hosted by SEMI Americas) as an event sponsor—great conversations with industry leaders on what it will take to keep Arizona’s semiconductor momentum going. In his session, Brad Perkins (our Head of Global Product Management) shared five practical focus areas for Arizona’s next chapter: 💡Connect the full value chain—from research to logistics to materials, packaging, and fabs 💡Understand how market drivers are converging 💡Meet rising expectations for innovation, speed, cost, quality, reliability, and sustainability 💡Treat the industry as what it is: an interconnected supply chain 💡Keep investing in infrastructure, R&D, and workforce development At EMD Electronics, we’re proud to help connect the dots in Arizona—from materials and manufacturing to talent and infrastructure—so U.S. chipmaking can keep moving faster and stronger. 💪 #Semiconductors #SupplyChainResilience #MaterialsInnovation

We’re continuing to build on the momentum from CES—this time at CES on the Hill! In an exclusive showcase for U.S. congressional leaders, our experts demonstrated our #AR technology in action and shared how we’re approaching innovation responsibly. “By continuing the conversations started at CES in January, we are advocating for practical policy outcomes that support safe, sustainable electronics while accelerating innovation across our industry.” – Stephanie Salvagno Frye, our Head of Government Affairs. Thank you to everyone who stopped by our booth and tried our AR glasses. What did you want to experience next? Check out the recap of CES on the Hill: https://lnkd.in/eV8-9j5Q #CTATechWeek #CES #CESontheHill Consumer Technology Association

AI is evolving faster than the hardware that supports it. Today, the "electron bottleneck" in terms of speed and energy consumption is the number one challenge facing everything from our daily gadgets to global data centers.   With decades of expertise in optronics, we believe the next leap in computing will come from light. By leveraging our expertise in electro-optic materials, we are enabling the development of cutting-edge technologies that push the boundaries of what is possible in data transmission and processing.   Learn more about How We Materialize the Light: https://lnkd.in/dTbNdKpG   #Photonics #opticsonchip #WeMaterializeLight #Optronics #NextGenComputing