We’re going back to the basics with this Word(s) of the Week. Hint: If you were to describe what Lam does in two words, what would those two words be? Swipe below to see if you have the same idea as us. 😉
Lam Research
Semiconductor Manufacturing
Fremont, CA 508,789 followers
Driving semiconductor breakthroughs that define the next generation. Trusted partner of the world’s leading chipmakers.
About us
Lam Research Corp. (NASDAQ:LRCX) At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration. The impact we have on the world is made possible by focusing on our people. We recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities. Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible. Ready to help define the future of technology? Join us: www.lamresearch.com/careers
- Website
-
http://www.lamresearch.com
External link for Lam Research
- Industry
- Semiconductor Manufacturing
- Company size
- 10,001+ employees
- Headquarters
- Fremont, CA
- Type
- Public Company
- Founded
- 1980
- Specialties
- Semiconductor Manufacturing Equipment, Global Services, Fabrication Technology, Chipmaker Solutions, Microprocessors, and Wafer Processing
Employees at Lam Research
View 18k employees at Lam Research
or
Locations
Updates
-
What does it take to cut part retrieval time from six minutes to less than 30 seconds? Fifteen automated robots and a decision to consolidate eight California logistics facilities into one hub. On September 28, we celebrated the ribbon cutting at our new Livermore warehouse with Karthik Rammohan, Sr. VP of Global Operations and Enterprise Solutions. Karthik was joined by State Senator Jerry McNerney, Livermore Mayor John Marchand, and our DHL partners who will help operate the site. The facility is expected to support more than 200 jobs by 2027 and complements our network of R&D, manufacturing, logistics, and office space across Silicon Valley. https://bit.ly/4e76etJ
-
2 nm chips are moving into the next phase of semiconductor manufacturing. What does that mean for the devices and technologies we use every day? Swipe through to see where 2 nm chips could make an impact, then read our latest blog post for a closer look at the technology behind them. https://bit.ly/4rdcULx
-
What happens when AI pushes chip packages to get bigger and more complex? Enter panel-level processing (PLP). In this edition of Movie Monday, see why the industry is looking beyond traditional wafers and how PLP enables larger, more scalable advanced packages. https://bit.ly/4xN1twI
-
In a gate-all-around (GAA) transistor, all channels should carry current evenly, but stress differences between stacked nanosheets can throw that balance off and negatively impact performance. See how our Semiverse® Solutions team used SEMulator3D® with integrated stress modeling to identify ways to improve stress uniformity across the stack. https://bit.ly/3VhZu5J
-
-
When the play calls for precision at depth, our Syndion® product family delivers. See why it’s a starting lineup staple for deep silicon etch. ⬇️ https://bit.ly/4AhLvNp
-
POV: You’re scaling 3D NAND to new heights and facing manufacturing challenges along the way. See the advanced techniques helping enable continued 3D NAND scaling: https://bit.ly/4x1GDJC
-
What does it take to manufacture the interconnects behind advanced packaging? Our SABRE® 3D platform uses precision copper plating to enable void-free fill in high-aspect-ratio structures to maintain low defectivity and deposition uniformity required for scalable manufacturing. Watch the video below and tap the link to read more. https://bit.ly/4h6Gz5d