tag: 2.5D

Power Integrity Without Blind Spots: A System Level Approach To 3D-ICs
By Muhammad Hassan - 09 Apr, 2026 - Comments: 0

Power delivery has become one of the defining challenges of next-generation semiconductor systems. As AI, high-performance computing, and data-centric workloads drive higher performance and tighter integration, traditional 2D SoC design approaches are reaching their limits. The industry’s shift toward 2.5D and 3D heterogeneous integration promises breakthroughs in performance and efficiency�... » read more

Beating The Heat In 3D Packages
By Laura Peters - 25 Mar, 2026 - Comments: 0

Key Takeaways: Thermal management is a central design constraint, requiring early, thorough planning. Accurate thermal simulation requires AI-driven adaptive meshing and real-world validation. Innovative STCO strategies can drastically reduce GPU peak temperature. As HPC and AI accelerators push power densities to 1kW and beyond, the heat generated by rapidly switching tran... » read more

System-level Reliability Verification for 2.5D/3D ICs Using Innovator3D IC and Calibre 3DPERC
By Siemens EDA - 04 Mar, 2026 - Comments: 0

The increasing demand for higher performance, lower power, and greater functionality in smaller packages has driven the rapid adoption of 2.5D and 3D Integrated Circuits (ICs). However, the inherent complexity of these multi-die architectures presents significant reliability verification challenges that traditional 2D flows cannot adequately address, particularly concerning electrostatic discha... » read more

Catching Critical Defects In TSVs And Stacked Chips
By Laura Peters - 10 Feb, 2026 - Comments: 0

Key Takeaways Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate and distinguishing between yield-killing and false positives. New methods for interconnecting devices using through-silicon vias (TSVs) and hybrid bonding in stac... » read more

Why Move To 2nm?
By Ed Sperling - 04 Feb, 2026 - Comments: 0

Key Takeaways: Scaling digital logic still provides significant benefits, especially lower power. Multi-die assemblies will be the predominant approach, and most of the circuitry will not be 2nm or below. While these systems are inherently more flexible, the number and complexity of tradeoffs required for optimizing PPA/C are increasing. The rollout of 2nm process nodes and ... » read more

Chiplet Fundamentals For Engineers: eBook
By Bryon Moyer - 02 Feb, 2026 - Comments: 1

Multi-die assemblies are the next phase of Moore's Law, scaling up and out  to improve performance and add flexibility into designs. By decomposing SoCs into building blocks, yield improves for the individual dies and overall performance increases because a chip is no longer bound by reticle limits. But this is much harder than it sounds. Chiplets don't just snap together like LEGOs, and so... » read more

Reliability And Traceability In Advanced Packages
By Ed Sperling - 24 Dec, 2025 - Comments: 0

The move from planar SoCs to advanced packages can improve performance and provide flexibility in large designs, which are difficult to fit onto a single reticle-sized die. But ensuring the device works as expected remains a challenge. There are multiple packaging options to choose from — 2.5D, fan-out wafer-level packaging, 3D-ICs, and various types of system-in-package — and many possible... » read more

When To Move To Multi-Die Assemblies
By Ann Mutschler - 23 Dec, 2025 - Comments: 0

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it's often not feasible to fit everything onto a single planar die. But determining when to move to a multi-die assembly isn't always straightforward. Multi-die approaches have some well-documented benefits. They allow designers to split functions across different dies, which can impro... » read more

Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)
By Technical Paper Link - 22 Dec, 2025 - Comments: 0

A new technical paper titled "3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems" was published by researchers at EPFL and Universidad Complutense de Madrid. Abstract "The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps w... » read more

What’s Next for 2.5D Packaging?
By Bryon Moyer - 18 Dec, 2025 - Comments: 0

Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they're built and assembled. Interposers are becoming thicker and more complex, while bridges are being used to reduce the assembled cost. Both efforts are facing new challenges. Interposers are effectively platforms on which mu... » read more

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